TechDebt 2023
Sun 14 - Mon 15 May 2023
Melbourne, Australia
co-located with
ICSE 2023
Toggle navigation
Attending
Venue: Melbourne Convention Exhibition Centre | MCEC
Keynotes
Social Event
Program
TechDebt Program
Your Program
Sun 14 May
Mon 15 May
Tracks
TechDebt 2023
Technical Papers
Short Papers
Industry Track
Plenary
Organization
TechDebt 2023 Committees
Organizing Committee
Steering Committee
Track Committees
Technical Papers
Short Papers
Industry Track
Contributors
People Index
Search
Series
Series
TechDebt 2025
TechDebt 2024
TechDebt 2023
TechDebt 2022
TechDebt 2021
TechDebt 2020
TechDebt 2019
TechDebt 2018
Sign in
Sign up
ICSE 2023
(
series
) /
TechDebt 2023
(
series
) /
Elena Sherman
ICSE 2023 profile
conf.research.org general profile
ASE 2019 profile
ASE 2020 profile
ASE 2021 profile
ASE 2022 profile
ASE 2023 profile
ECOOP 2019 profile
ECOOP and ISSTA 2018 profile
ECOOP and ISSTA 2021 profile
ECOOP and ISSTA 2023 profile
ESEC/FSE 2018 profile
ESEC/FSE 2020 profile
ESEC/FSE 2022 profile
FSE 2025 profile
ICSE 2020 profile
ICSE 2022 profile
ICSE 2025 profile
ISSTA 2017 profile
ISSTA 2020 profile
ISSTA 2025 profile
ISSTA/ECOOP 2024 profile
SPLASH 2022 profile
Registered user since Tue 9 Jan 2018
Name:
Elena Sherman
Country:
United States
Affiliation:
Boise State University
Contributions
2023
ICSE
Program Committee Member in Technical Track within the Technical Track-track
AST
Structural Test Input Generation for 3-Address Code Coverage Using Path-Merged Symbolic Execution
Show activities from other conferences
Share
ICSE 2023-profile
View general profile
x
Sat 23 Nov 09:25