Sun 14 MayDisplayed time zone: Hobart change
09:00 - 10:30 | |||
09:00 15mDay opening | Conference Opening Plenary | ||
09:15 75mKeynote | Titus Winters: Tech Debt Metaphors Aren’t Helping Plenary |
11:00 - 12:30 | |||
11:50 15mShort-paper | Automated Self-Admitted Technical Debt Tracking at Commit-Level: A Language-independent Approach Short Papers Mohammad Sadegh Sheikhaei School of Computing, Queen's University, Yuan Tian Queens University, Kingston, Canada Pre-print | ||
12:05 15mShort-paper | Measuring Improvement of F1-Scores in Detection of Self-Admitted Technical Debt Short Papers William Aiken University of Ottawa, Paul K. Mvula University of Ottawa, Paula Branco University of Ottawa, Guy Jourdan University of Ottawa, Mehrdad Sabetzadeh University of Ottawa, Herna Viktor University of Ottawa Pre-print |
Accepted Papers
Call for Papers
The Short Papers Track of TechDebt 2023 is a variation on the Tools Track of previous editions of TechDebt and will be open to different types of submissions that present current work-in-progress and be based on either research, practice, or experience. Unlike previous editions of TechDebt, Early Research Achievements Papers are no longer a subcategory of the Technical Papers Track but part of the Short Papers Track.
The Short Papers track invites submissions of papers in any areas related to the theme and goal of the conference in the following categories:
- Short Papers (up to 5 pages): early stages of research, including new ideas, visions and/or reflections, and Ph.D. proposals; or negative results.
- Tool Papers (up to 5 pages): innovative and original tools addressing technical debt issues or aiming at managing technical debt.
Openness in science is key to fostering progress via transparency, reproducibility, and replicability. While all submissions will undergo the same review process independent of whether or not they disclose their analysis code or data, we strongly encourage authors to make the data available upon submission (either privately or publicly) and especially upon acceptance (publicly). If the authors cannot disclose industrial or otherwise non-public data, they should provide an explicit (short) statement in the paper.
Evaluation Criteria
The review criteria for Short Papers are as follows:
- originality and novelty.
- importance to the field and potential impact.
- technical soundness.
- quality of the presentation.
- clarity of relation with related work and its relevance to technical debt.
The review criteria for Tool Papers are as follows:
- value, usefulness, and reusability of the datasets or tools.
- quality of the presentation.
- clarity of relation with related work and its relevance to technical debt.
- availability of the tools.
Submission
To ensure proper peer review, please include the paper type (Short Paper or Tool Paper) in the title when submitting. It can be removed upon acceptance. For Short Papers, it is also requested to include more detailed information (new ideas, visions and/or reflections, Ph.D. proposals, or negative results).
Submissions must be original and unpublished. Submitted Short Papers will undergo double-anonymous peer review (see the ICSE 2023 Q&A for details) and Tool Papers will undergo single-anonymous peer review. Please choose whether to submit anonymously or not at the time of submission in HotCRP.
Papers must be submitted electronically via HotCrp. Submissions must be in PDF and conform to the IEEE formatting guidelines applied for ICSE 2023. Submissions may not exceed the number of pages specified above (including all text, references, and figures). The purchase of additional pages in the proceedings is not allowed.
Formatting instructions are available for both LaTeX and Word users at: https://www.ieee.org/conferences/publishing/templates.html (title in 24pt font and full text in 10pt type, LaTeX users must use \documentclass[10pt,conference]{IEEEtran}
without including the compsoc
or compsocconf
options).
Submissions are via HotCrp: https://techdebt2023-shortpapers.hotcrp.com/
The official publication date is when the proceedings are available in the ACM or IEEE Digital Libraries. This date may be up to two weeks prior to the first day of TechDebt 2023. The official publication date may affect the deadline for any patent filings related to published work.