TechDebt 2023
Sun 14 - Mon 15 May 2023 Melbourne, Australia
co-located with ICSE 2023
Sun 14 May 2023 14:10 - 14:35 at Meeting Room 101 - Technical Debt Management

Underlying and undiscovered technical debt (TD) that burdens the system and makes future changes more costly or impossible poses significant risks to mechatronic systems. Multi-disciplinary collaboration and cooperation lead to interdisciplinary interfaces and new life cycle phases that cause greater ripple effects to the TD distribution. When quantifying TD contagiousness in interdisciplinary engineering, only a few metrics, methods, or tools prove applicable. In this work, we propose a method containing two key metrics to quantify TD contagiousness across product life cycles and disciplines. Furthermore, we suggest a matrix multiplication method to quantify the adverse impact on each discipline and the system. By applying the methods to the data of three comparable companies in the industrial automation domain, the results enable us to measure and prioritize the TD incidents’ contagiousness. This method provides a first step towards the systematic quantification of TD in the interdisciplinary environment and provides metrics to compare systems based on objective factors.

Sun 14 May

Displayed time zone: Hobart change

13:45 - 15:15
Technical Debt ManagementTechnical Papers / Plenary at Meeting Room 101
Research paper
The Type to Take Out a Loan? A Study of Developer Personality and Technical Debt
Technical Papers
Lorenz Graf-Vlachy University of Stuttgart, Stefan Wagner University of Stuttgart
Research paper
Technical Debt Contagiousness Metrics for Measurement and Prioritization in Mechatronics
Technical Papers
Fandi Bi Technical University of Munich, Birgit Vogel-Heuser Karlsruhe Institute of Technology, Fengmin Du ETH Zürich, Nils Hanich Technical University of Munich, Eunnuri Cho Technical University of Munich
How to introduce TD Management into a Software Development Process – A Practical Approach
Technical Papers
Markus Finke KUKA Deutschland, Thomas Neff KUKA Deutschland, Tobias Reichl KUKA Deutschland
Live Q&A
Open Q&A